Semiconductor intelligence firm TechInsights has concluded, following a teardown of Huawei Technologies’ Ascend 910C chip, that some of the components still come from Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics, and SK Hynix. The analysis showed that the chip die for the Ascend 910C was produced by TSMC and used high-bandwidth memory 2 enhanced (HBM2E) supplied by Samsung and SK Hynix.