TSMC is fast-tracking its capacity expansion with plans to build nine new facilities in 2025, including eight wafer fabs and one advanced packaging plant. The move has energized sentiment across its supply chain. Advanced Echem Materials Company (AEMC) Chairman Chan Wen-hsiung said the firm had already anticipated this expansion, citing new capacity at its Tainan and Kaohsiung facilities as sufficient to support customer needs through 2030. A US plant is not under consideration before then and would only be evaluated after that timeline.