At the TSMC Technology Symposium 2025 on May 15 in Hsinchu, Taiwan, T.S. Chang, VP of Advanced Technology and Mask Engineering at TSMC, announced the company’s accelerated fab expansion plans. Previously, TSMC built an average of three fabs annually from 2017 to 2020, which increased to five each year from 2021 to 2024. In 2025, TSMC aims to construct nine new facilities, consisting of eight wafer fabs and one advanced packaging plant.