Taiwan’s printed circuit board (PCB) manufacturers and outsourcing semiconductor assembly and test (OSAT) providers are positioned for significant growth driven by artificial intelligence (AI), 5G/6G communications, and automotive electronics. However, they face challenges, including supply chain vulnerabilities, talent shortages, and a lack of unified packaging standards. Devan Iyer, CSO for Advanced Electronic Packaging at the Global Electronics Association, outlined these issues and opportunities in an exclusive interview with DIGITIMES.