To accelerate the development of heterogeneous integration and advanced packaging technologies, the “3DIC Advanced Manufacturing Alliance” was officially established on September 9, 2025. Co-chaired by TSMC and ASE Holding, the alliance brings together over thirty major companies, including Unimicron, Delta Electronics, Everlight Chemical, Scientech, Chroma ATE, GPTC, Allring, and GMM, to promote cross-domain collaboration and standardization, building a comprehensive global 3D IC ecosystem.