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xMEMS unveils revolutionary cooling SoC for AI devices

US-based xMEMS Labs has developed the XMC-2400 µCooling™, a single-chip (SoC) air-cooled all-silicon active cooling solution utilizing semiconductor micro-electro-mechanical systems (MEMS) technology. This innovative chip, acting like an “ice jacket” for AI chips, can be customized in size and intelligently controlled to meet specific cooling needs.