As AI model training scales up and cloud service providers (CSPs) accelerate the buildout of high-performance data centers, switch bandwidth is moving from 51.2Tbps to the 102.4Tbps generation, raising stricter requirements for power consumption, thermal management and serviceability in high-speed optical interconnects. Co-packaged optics (CPO) is regarded as a key architecture to overcome the power limitations of traditional pluggable optical modules, driving laser modules, packaging integration and high-speed interconnect technologies to the forefront of supply chain deployment.