South Korean thermal compression bonder leader Hanmi Semiconductor has announced the development of the industry’s first dual-function BOC COB Bonder, capable of performing both Board-on-Chip (BOC) and Chip-on-Board (COB) processes within a single system, according to Yonhap News Agency and Maeil Business Newspaper. The company says the equipment is designed to improve process flexibility and production efficiency for high-performance memory products.