Rebellions unveils chiplet AI accelerator to challenge Nvidia in hyperscale market

Korea-based Rebellions unveiled its next-generation AI accelerator, REBEL-Quad, at the Hot Chips 2025 symposium in California, positioning itself as a direct rival to Nvidia’s Blackwell processors. The chip is the world’s first neural processing unit (NPU) to adopt the UCIe-Advanced standard for chiplet interconnect, a design that enables faster and more power-efficient data transfer.

Continue reading

Quanta’s Techman Robot prepares for IPO with backing from chairman Barry Lam

At a pre-IPO briefing held on Monday, Techman Robot, a leading Taiwanese collaborative robot (cobot) manufacturer, laid out its vision for the future as it prepares to debut on the capital markets. The event was marked by a personal appearance from Barry Lam, chairman of Quanta Computer, Techman’s parent company, who praised the company’s achievements and symbolic significance.

Continue reading

The 7-year car loan becomes new standard in America

The traditional five-year auto loan is no longer the norm in the US. Driven by rising vehicle prices—fueled in part by tariffs on cars and auto parts—limited vehicle availability, and inflation reshaping consumer behavior, longer-term financing has become increasingly common. Six-year loans now dominate the market, while the share of seven-year loans is climbing at a record pace.

Continue reading

Nvidia’s CoWoP PCB architecture targets ABF substrates but faces warpage risk

Nvidia’s new advanced packaging technology, Chip-on-Wafer-on-Platform (CoWoP), has moved into testing with engineering samples of its base printed circuit boards (PCBs) under verification. Key suppliers involved in early development include Taiwan’s Zhen Ding Technology Holding, Unimicron Technology Corp., and Compeq Manufacturing Co., along with China’s WUS Printed Circuit (Kunshan) Co. and Victory Giant Technology (HuiZhou) Co.

Continue reading