As the global semiconductor industry enters the post-Moore’s Law era amid surging demand for artificial intelligence (AI) and high-performance computing (HPC), advanced packaging has become a critical technology shaping technological competitiveness and industrial layout. On January 13, 2026, Taiwan’s National Institutes of Applied Research (NIAR) unveiled its chip-level advanced packaging R&D platform.

Taiwan’s IC design segment posted a visibly divergent finish in December 2025, with AI/HPC, data center, and enterprise storage-related suppliers closing the year strongly, while consumer electronics-facing lines weakened amid seasonality, cautious panel and handset component pull-ins, and ongoing inventory adjustment.

The US Department of Commerce recently revoked restrictions imposed by the Federal Communications Commission (FCC) in late December 2025 that banned imports of new drones and components from Chinese manufacturers, including DJI and Autel Robotics, due to national security concerns. This reversal complicates earlier assumptions that Taiwanese suppliers would gain significantly from displaced orders. However, industry experts suggest the impact on Taiwan’s industrial PC (IPC) sector may be limited.