Taiwan’s Tatung held an earnings call on August 18, during which company president Sung-pin Chang stated that the group’s self-built artificial intelligence (AI) data center proof of concept (PoC) has entered the manufacturing stage, with units being sent to project sites for testing starting this month. The overall build is expected to be completed in September 2026, with further results related to its AIDC revealed at a later time. The group also announced it has successfully secured an order from an edge AI customer.

Custom System-on-Chip (SoC) designer Socionext has selected Intel Foundry’s 18A-P process node to build its next-generation custom silicon, aiming to accelerate workloads across data centers, edge computing, and artificial intelligence (AI).

Advanced Micro Devices (AMD) recently announced its acquisition of Canadian AI chip startup Taalas to sharpen its competitive edge in AI inference. Taalas’ core technology bakes model weights directly onto the silicon rather than relying on traditional high-bandwidth memory (HBM).

Google has told suppliers it plans to move all production of Pixel smartphones, smartwatches and wireless earbuds out of China starting in 2027, after making progress developing and producing high-end Pixel phones in Vietnam this year.