Sercomm reported record June 2026 revenue of NT$7.27 billion, up 12.2% from May and 70.8% from a year earlier, as AI-related network traffic and broadband infrastructure upgrades lifted demand. The telecom broadband equipment maker said the strong performance also pushed second-quarter and first-half revenue to all-time highs.
South Korea is moving to position itself as an exporter of “intelligence” rather than just the chips and equipment that go into building it, with SK Group chairman Chey Tae-won outlining an AI data center plan expected to involve more than KRW1,000 trillion (approx. US$652.7 billion) in investment, according to Hankyung.
While the overall mobile market outlook for the second half of 2026 is not especially strong, foldable phones are drawing attention because Apple’s first foldable phone is finally expected to arrive. Industry watchers broadly believe the move will inject fresh momentum into the foldable phone market, with Samsung Electronics, Google, Huawei, Xiaomi, and other Android brands also expected to join the broader discussion around the segment.
Amid ever-shifting geopolitical concerns and a US$50 billion injection from the CHIPS and Science Act to revitalize domestic semiconductor production, a new round of competition has arisen across the US to attract investment. For Taiwan’s electronics sector, the question is no longer whether to invest in the US, but which state to choose.
AI demand and capacity crowd-out effects are driving higher prices and volumes for high-voltage products, according to IC distributors, who say early pull-ins and price negotiations have become the market norm. But as concerns over an AI bubble resurface, some industry players warn that if a profitable AI business model does not emerge soon, the sector may not even make it to the ninth inning.
Corning has unveiled an early-stage fiber-to-chip connector concept that could reshape optical packaging if it matures, though the company says the technology is still far from commercial use. GlassBridge is aimed at passive alignment in advanced systems, underscoring the convergence of AI infrastructure, photonics, and packaging.
Global markets are likely to feel the effects of a renewed rise in memory prices, as tighter supply and early inventory buying lift DRAM and NAND prices again in mid-June 2026. The trend could ripple through smartphones, PCs, and servers, while Apple’s possible sourcing shifts may influence pricing across the wider semiconductor industry.
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