Longsys forecasts sharp 1H26 profit growth on stronger memory market, AI demand
Apple price hikes spur brisk used-device trading
Apple’s recent price increases for Mac and iPad products are rapidly spilling into the used-device market, as consumers turn to refurbished and secondhand channels to fight inflation. Data from Chinese secondhand trading platforms show that some MacBook models have risen by nearly CNY1,000 (US$147.29) within just 10 days, signaling a new round of price swings in the end-user market.
Kingboard raises CCL prices again as AI demand tightens PCB material supply
Foreign automakers turn China plants into export hubs as Toyota takes slower path
China’s IC design boom nears CNY1 trillion, but Nvidia CUDA gap exposes limits
China’s IC design industry is nearing CNY1 trillion (approx. US$150 billion) ahead of schedule, but AI is exposing deeper gaps in computing architecture, high-end talent, and ecosystem control.
South Korea’s chip hub push, led by Samsung, SK, draws KRW896 trillion — and a market selloff
SK Group, Samsung Electronics, and Amkor will invest a combined KRW896 trillion (US$585.2 billion) to build South Korea’s second major semiconductor production base in the country’s southwest, the industry ministry said.
South Korea lines up US$204 billion Yeongnam manufacturing push
South Korean conglomerates will invest a combined KRW312 trillion (approx. US$203.6 billion) in the Yeongnam region, as the government moves to turn the country’s southeast into a hub for advanced manufacturing, AI infrastructure, semiconductors, aerospace, defense, and energy.
South Korea weighs longer hours for chip R&D in new tech zones
South Korea is considering exempting research and development personnel from the country’s 52-hour workweek limit inside proposed Mega Special Zones. These would include a planned second semiconductor cluster in the southwestern Honam region.
China advanced packaging maker SJ Semiconductor starts US$1.5bn 3DIC project for AI chips
SJ Semiconductor has started construction of a CNY10 billion (approx. US$1.47 billion) 3DIC manufacturing project in Shanghai’s Lingang New Area, expanding advanced packaging capacity for high-performance computing, AI and data center chips.