Acer’s 50th anniversary focuses on talent cultivation in Taiwan

Acer is celebrating its 50th anniversary, having started in 1976 with a total capital of NT$1 million (US$31,800 in today’s value). As of April 27, 2026, the broader Acer Group family includes 43 publicly listed companies. Founder Stan Shih emphasized that Acer’s greatest contribution lies in nurturing talent for Taiwan, which he said has created intangible and long-lasting value.

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Taiwan’s 2026 exports set to top US$800 billion as AI fuels electronics surge

Taiwan’s exports were forecast to surpass US$800 billion in 2026, driven by strong demand for electronic components and information and audiovisual products tied to artificial intelligence, according to China Credit Information Service. The projection followed a record first quarter when exports reached US$195.74 billion, marking the highest quarterly total on record and a 51.1% year-over-year increase.

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ASE signs cybersecurity MOU with national institute to shore up semiconductor defenses

Advanced Semiconductor Engineering (ASE) and the National Institute of Cyber Security signed a memorandum of understanding on April 28 to establish a joint cyber defense, intelligence sharing, and cooperation framework aimed at countering complex global cyber threats. The agreement will integrate technical resources and real-time threat intelligence to strengthen industry-wide defenses for the semiconductor sector, with an emphasis on protecting smart manufacturing and core corporate assets in Kaohsiung.

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Amkor records strong 1Q26, advanced packaging expected to triple YoY

Amkor Technology is off to a record start in 2026. First-quarter revenue hit US$1.68 billion, up 27% from the prior year, driven by record performance in AI data center applications and a fourth consecutive quarter of growth in automotive and industrial segments. Earnings per diluted share came in at US$0.33, beating analyst expectations on the back of a favorable product mix and disciplined cost management. The company’s strategy is firmly anchored in high-value advanced packaging for AI and High-Performance Computing (HPC). CEO Kevin Engel noted that several High-Density Fan-Out (HDFO) programs are underway, with a new data center CPU device beginning its ramp this quarter.

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Commentary: Honor retools for humanoid robotics, rewrites AI device playbook

Honor’s surprise win at this year’s Beijing humanoid robot half-marathon has stirred industry debate, not only for its on-track performance but for what the move signals about shifting competitive dynamics. The smartphone maker’s cross-sector push into robotics has reignited questions over whether embodied AI and humanoid systems could trigger a new round of market reshuffling.

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Meta bets on orbit-to-grid solar to power AI infrastructure around the clock

Meta announced partnerships with Overview Energy and Noon Energy to develop space-based solar collection and ultra‑long‑duration energy storage, aiming to support its data centers and AI infrastructure. These projects could extend renewable generation and store clean power for days, with implications for grid reliability and how organizations use energy worldwide.

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Macronix returns to profit in 1Q26, citing tighter supply and higher memory prices

Macronix’s return to profitability in the first quarter of 2026 signals supply constraints and stronger memory pricing, with implications for global flash markets and customer supply chains. The Taiwan-based memory maker reported wider margins, robust NAND growth, and reduced inventories, suggesting that tighter industry supply and higher ASPs could significantly reshape pricing and sourcing worldwide.

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