Nvidia’s Madison Huang is set to visit LG Electronics’ Yangjae R&D campus in Seoul on August 18 to inspect the company’s robot data factory and hold closed-door talks with senior LG executives on robotics cooperation, according to Yonhap and Chosun Biz.
TSMC, Micron, ASE, and SPIL continue to expand their advanced-node and OSAT investments, driving stronger first-half 2026 results for Taiwan’s fab engineering players — including UIS, MIC, L&K Engineering, YKE and Acter. Together, these five companies, which design and build the specialized facilities and infrastructure that chipmakers rely on, make up what the industry calls the “fab five.” With expanding reach into the US, ASEAN and Singapore, the “fab five” have maintained high order backlogs.
Samsung Electronics is reportedly considering repurposing the second line at its next-generation semiconductor R&D complex in Giheung into a foundry send-fab, a shift that would add advanced-node capacity as demand for AI memory strains leading-edge capacity.
India’s electronics and AI infrastructure ambitions are accelerating, but mounting environmental opposition, tighter Chinese visa curbs, and intensifying competition for semiconductor investment are exposing new challenges. As Google advances a US$15 billion AI data center, Larsen & Toubro (L&T) restructures its cloud business, and Dixon Technologies expands its smartphone OEM business, states are sweetening incentives to strengthen India’s position in global technology supply chains.
Twoway Communications said its July 2026 consolidated revenue was NT$139 million (US$4.3 million), down 0.4% from a year earlier. For January to July 2026, consolidated revenue reached NT$1.1 billion, up 35.0% from the same period in 2025.
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