BMW AG said at its capital markets day on September 30 that it plans to use artificial intelligence (AI) to help streamline one-fifth of management roles by mid-2027. As BMW pushes to boost organizational agility through more efficient use of AI, the cuts will later extend to frontline ranks.

ficonTEC, a maker of optoelectronic automation assembly and test equipment, has announced a strategic partnership with Hermes Testing Solutions Inc. (HTSI) to support Taiwan’s rapidly expanding co-packaged optics (CPO) ecosystem. The collaboration will initially focus on the INS-2 test platform, advancing ficonTEC’s double-sided wafer-level testing architecture — with electrical testing from above and optical testing from below — towards commercialisation and scaled deployment.

Rumors that TSMC is weighing a new semiconductor investment in Singapore have reignited concerns over its overseas expansion, while the Ministry of Economic Affairs (MOEA) said on October 2, 2026, that the government will help the chipmaker expand investment in Taiwan.

Nvidia is testing glass-free PCB material systems for its next-generation AI server platforms, evaluating polytetrafluoroethylene (PTFE) and hydrocarbon (HC) resin formulations for possible use in the Rubin Ultra NVL576 Switch Tray, which is scheduled for mass production in the second half of 2027.