With less than an hour remaining before a planned strike was set to begin, Samsung Electronics and its labor union reached a tentative agreement late on May 20, narrowly avoiding what industry observers estimated could have triggered supply-chain disruptions worth more than KRW100 trillion (US$66.8 billion).

Apple’s new Chief Hardware Officer, Johny Srouji, has launched a reorganization of the company’s device development division. The move shifts executive responsibilities over core product design to accelerate future hardware cycles. According to Bloomberg, the changes integrate the previously independent domains of hardware engineering and hardware technologies under a single leadership structure. The realignment is part of a broader succession plan, following Apple’s announcement that John Ternus — longtime senior vice president of hardware engineering — will become Chief Executive Officer on September 1, 2026.

META Green Cooling Technology (MGC) president Clyde Chu said Nvidia’s chip roadmap shows that cooling requirements are doubling in less than a year, with the NVL72 rack based on the Vera Rubin architecture, expected in the second half of 2026, requiring 130-140 kW of cooling capacity per rack. By 2027, the Vera Rubin Ultra platform could push single-rack power consumption to 200-300 kW.