Flexible circuit board maker Complex Micro Interconnection (CMI) said June 2026 revenue rebounded as consumer electronics shipments increased, even as shortages in automotive components and notebook memory continued to affect customers. The company also reported second-quarter revenue of NT$597 million (US$18.55 million), up 3.6% from the prior quarter.
Foxconn is using AI and coordinated security teams across Asia, Europe and the Americas to defend against cyberattacks as enterprises increasingly adopt AI. Chief Information Security Officer Wei-Bin Lee said that the company’s global footprint makes it a prime target.
The world’s most powerful AI models are encountering a new constraint beyond chips, data and engineering talent: governments increasingly want a say in when frontier systems are released, who may access them and which capabilities should remain restricted.
Tesla and SpaceX are already converging around chips, talent and manufacturing under Terafab, even before any merger speculation turns into reality.
As infrastructure upgrades, rail decarbonization, and the reshaping of critical materials supply chains accelerate, the steel industry is moving away from mass production and into a new competitive stage that combines high-performance materials, smart manufacturing, and low-carbon development. What once centered on capacity, cost, and supply is now defined by material performance, process precision, carbon management, and international certifications.
The 2026 Hisense U7S Pro series has been available in Europe for more than a month, but it deserves an “at-a-glance” article since Hisense manages to squeeze into it high-end tech and features into it and produce TVs that do not cost an arm and a leg. Hisense 85U7S Pro – specifications; EUR 2035 Hisense 75U7S Pro – specifications; EUR 1835 Hisense 65U7S Pro – specifications; EUR 1195 Hisense…No account yet?
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