Intel pushes large-area AI packaging to close foundry gap
Intel is reportedly preparing large-area AI chip packaging to strengthen its foundry business and challenge TSMC and Samsung Electronics.
20
Mar
20
Mar
Lumotive creates world’s first 2D photonic beamforming chip
Lumotive, a pioneer in programmable optical semiconductor technology, has demonstrated the world’s first programmable two-dimensional (2D) photonic beamforming chip. Built on its Light Control Metasurface (LCM) architecture, the chip enables electronic control of light across two dimensions within a single device — a capability long pursued in optical science and widely considered essential for scalable programmable optical systems.
19
Mar
New Chinese AI service startup analysis
Zhipu and MiniMax’s rapid revenue growth but expanding losses highlight that Chinese AI service startups will face severe elimination challenges in 2026.
19
Mar
Nvidia hosts Taiwan night at GTC 2026, Huang vows to defend Taiwan
Nvidia’s GTC 2026 is well underway, with the event reaching a record scale as among the major annual events in the AI landscape. Despite a packed schedule, CEO Jensen Huang attended the conference’s “Taiwan Night” on March 18 (local time) to engage with Taiwanese partners and express his appreciation for their work.
19
Mar
Analysis: GTC 2026 widens US-China AI compute gap
The annual Nvidia GTC conference has become a global barometer for the artificial intelligence (AI) industry. In a nearly two-hour keynote, Nvidia CEO Jensen Huang laid out a clear vision for AI’s future: a shift in focus from model and algorithm competition to competition over computing power, efficiency, and commercial deployment.
19
Mar
Nvidia positions Groq 3 LPUs alongside Vera Rubin for an inference-first era
The 2026 Nvidia GTC keynote signaled a clear industry shift toward inference. CEO Jensen Huang declared that “training is just the beginning — inference is the core battleground for AI commercialization.” Attendees expected AI agents to dominate the event’s agenda.
19
Mar
Samsung Electro-Mechanics rumored to supply MLCCs to top private aerospace firm
Samsung Electro-Mechanics (Semco) is reportedly supplying multilayer ceramic capacitors (MLCC) for low Earth orbit (LEO) satellites to the world’s largest private aerospace company. According to industry sources, this expansion from the automotive and industrial sectors into aerospace is a significant step for the company, as it demonstrates that its components have gained global recognition for durability and reliability.
19
Mar
Gulf crisis drives up petrochemical and semiconductor costs
As fighting in the Middle East continues, the closure of the Strait of Hormuz has sent shockwaves through global energy and petrochemical markets. The disruption is already rippling across supply chains, prompting manufacturers such as Shin-Etsu Chemical to scale back production of ethylene-based products and raise domestic polyvinyl chloride (PVC) prices in Japan by roughly 20%.
19
Mar
Taiwan turns to Stargate playbook: private capital powers AI infrastructure
Foxconn (Hon Hai) plans to build an AI data center in Taiwan by 2027 with over 10,000 GPUs. That figure dwarfs the Ministry of Digital Affairs’ (MODA) target of just 140 GPUs by the end of 2026. MODA minister Yi-Jing Lin has acknowledged the gap is real. Taiwan’s answer, she says, is to follow the US Stargate playbook — mobilizing private investment through government tax incentives rather than direct public spending.
19
Mar
Fitipower opens Malaysia R&D center to boost global innovation and support
Fitpower officially inaugurated its new office in Puchong Financial Corporate Center (PFCC), Selangor, Malaysia, this week, marking the launch of its Malaysian subsidiary. The move expands Fitipower’s global R&D footprint and deepens collaboration within Southeast Asia’s semiconductor supply chain.