Lianyou Metals posts record second-quarter revenue as tungsten supply tightens

Lianyou Metals, a rare metals recycler focused on tungsten and cobalt, said its June consolidated revenue reached NT$750 million (US$23.36 million), up 22% from May and 555% from a year earlier. The Taiwan-based company also reported second-quarter consolidated revenue of NT$1.9 billion, rising 92% from the first quarter and 450% year on year, both record highs as the global tungsten supply chain remained tight.

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WITS posts record first-half revenue as AI and chip design drive growth

WITS reported consolidated revenue of NT$1.233 billion (US$38.41 million) in June, up 7.3% from May and 37.1% from a year earlier. The Taiwan-based IT services provider also said second-quarter revenue reached NT$3.623 billion, a quarterly increase of 6.6% and a yearly gain of 33.1%, while first-half revenue climbed 30.9% to NT$7.02 billion, both setting company records.

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TV panel prices fall in July as weak demand expected to hit 3Q26

The global LCD TV panel market moved into a down cycle in July after prices held flat in the second quarter of 2026. With pre-build demand cooling among brands, sales from China’s 618 Shopping Festival coming in weaker than expected, and panel factory utilization gradually recovering, the supply-demand relationship has shifted from tight to loose, dragging down prices across all LCD TV panel sizes and dimming what is usually a peak season in the third quarter.

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Interview: Why Geckos bets materials, not chips, will decide the next AI performance leap

As generative AI fuels rapid growth in demand for high-performance computing (HPC), the semiconductor industry is shifting from a process race to a materials race. Geckos chairman Shen Tsung-huan says that as chip manufacturing moves to 2nm and even more advanced nodes, gains in AI computing power are no longer just a chip design issue, but are increasingly constrained by the thermal conductivity and high-frequency signal transmission capabilities of materials.

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SunplusIT clears Intel and AMD eUSB hurdle, starts thermal imaging shipments ahead of July listing

Sunplus Innovation Technology (SunplusIT) said on July 9, 2026, that it is preparing to become a listed company in mid-July 2026 and outlined its view on market conditions in the second half of 2026 as well as its product roadmap. The company said its thermal imaging products have begun small-volume shipments, while its eUSB interface has passed certification for Intel and AMD new platforms, positioning it for future growth.

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