Taiwan semiconductor materials hit golden opportunity

Rising concerns over potential supply chain chokepoints for critical raw materials have driven the formation of the SEMI Taiwan Materials Alliance. Wei-Wang Chen, General Manager of Everlight Chemical and Chairman of the Taiwan Chemical Industry Association (TCIA), noted that Taiwan boasts the world’s largest tier-one customer demand alongside the most stringent process specifications. This unique position, he stated, presents a “once-in-a-century golden opportunity” for local semiconductor material development.

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SK Hynix charts advanced HBM packaging path: hybrid bonding, Intel EMIB and 3D integration

Competition in high bandwidth memory (HBM) is shifting from raw memory performance to advanced packaging. As bandwidth, capacity and stack heights keep climbing, thermal management, power consumption and packaging have emerged as the new bottlenecks. At Hot Chips 2026, SK Hynix laid out its advanced packaging roadmap in detail, moving from hybrid bonding to Intel’s EMIB and ultimately toward 3D integration.

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Europe’s struggling auto industry turns to China, drawing US scrutiny

European automakers have been increasing collaboration with their Chinese counterparts in recent years, as they seek to break through the vicious cycle of weak demand, rising costs, and low capacity utilization, as well as difficulties in their transition to electric vehicles (EVs). However, the fact that Europe is utilizing subsidies and collaborative efforts to expand production with Chinese carmakers while confronting overcapacity issues on its home turf is, in the eyes of the US, an absurd situation, and Washington has not ruled out the possibility of further tariffs or import restrictions on European cars.

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Analysis: SK Hynix pushes beyond HBM with HBF and CPO

SK Hynix is moving on several fronts as it pushes deeper into system-level memory competition. From high-bandwidth memory (HBM) and high-bandwidth flash (HBF) to a recently published roadmap proposing to extend co-packaged optics (CPO) to the memory interface, the company increasingly appears to be competing not just over the next generation of HBM, but over how future artificial intelligence (AI) systems organize and access memory.

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AI accelerator shipments are set to turn advanced packaging into the next battleground: Counterpoint

AI accelerator shipments are expected to reshape semiconductor demand worldwide, with implications for cloud operators, memory suppliers, and device makers in every major market. Counterpoint expects more than 130 million GPUs and AI ASICs to shift toward advanced-packaged on-compute memory over the next five years, as the industry braces for nearly US$2 trillion in compute revenue and an intensifying battle over packaging capacity.

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AI compute race heads toward space as MediaTek executive says 1 million H100s will be mid-tier by 2030

Speaking at DIGITIMES’ “AI on Chips: Semiconductor Industry Outlook Forum,” MediaTek senior director Bor-Sung Liang said AI development is shifting from individual large language models (LLMs) toward collaborative teams of AI agents with different roles and capabilities. He also revisited the seven-layer AI architecture he previously proposed, contrasting it with NVIDIA CEO Jensen Huang’s five-layer “cake.”

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