30
May
30
May
AOC U27G4D goes official with a 165Hz 4K QD-OLED Penta Tandem display
30
May
E Ink to unveil color e-paper platforms and large-format signage at Computex 2026
E Ink Holdings said it will showcase multiple color e-paper technologies and complete solutions at Computex 2026, presenting products aimed at outdoor and indoor advertising, smart retail and product-surface design. The exhibit will open around a premium shopping mall theme to demonstrate how e-paper can be applied across spatial and object surfaces for retail media networks and commercial signage.
30
May
AUO Micro LED CPO enters sampling stage
AUO’s entry into Micro LED co-packaged optics sampling could give the display maker a new growth path as it seeks to expand beyond panels. Chairman Paul Peng said the company is preparing optical communication modules as a future driver of revenue and profits.
30
May
Xpeng plays the long game: South Korea on hold, Europe in sight
Xpeng Motors, often described as “China’s Tesla,” is advancing on two very different international fronts — cautious and measured in South Korea, but increasingly strategic in Europe — while competing Chinese EV peers such as Zeekr accelerate their own overseas expansion.
30
May
AI server testing firm Wendell prepares IPO for high-power lab unit on surging rack equipment demand
Wendell Industrial Co. held its 2026 annual shareholders’ meeting on May 26, where chairman Kao Chih-hung said shareholders approved a proposal for its subsidiary, Wendell Electrical Testing, to apply for an IPO. The plan is expected to be carried out in the fourth quarter or in 2027.
30
May
Intel makes first major move into India’s semiconductor ecosystem with advanced glass substrate manufacturing MoU
India has signed a memorandum of understanding (MoU) with Intel and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in the eastern state of Odisha, marking Intel’s first significant participation in India’s semiconductor manufacturing ecosystem beyond its existing design and technology operations.
30
May
AI boom strains optical supply chain as Nvidia, Corning expand fiber output
The global AI boom is pushing supply-chain pressure beyond memory chips and CPUs into optical communications, creating shortages across a less visible but increasingly critical layer of data-center infrastructure.
30
May
Innolux turns to packaging, smart cockpits in higher-margin push
Innolux plans to accelerate its transformation in 2026, with chairman and CEO Jim Hung pointing to three priorities: advanced semiconductor packaging, smart cockpits, and higher-margin panel applications.
30
May
Terafab explained: SpaceX outlines space-optimized chips and AI megafab plan in IPO filing
SpaceX’s IPO prospectus details an early-stage “Terafab” initiative to build large-scale AI chip manufacturing capacity. Still, the company warns of significant execution uncertainty, unfinalized partnerships, and capital intensity risks. The plan, still in preliminary form, depends on future agreements and could face delays, cost overruns, and supply-chain constraints.