The global memory market is entering a sharp upcycle as cloud providers boost capital spending and demand for AI infrastructure lifts DRAM, NAND, and HBM prices. According to DIGITIMES, the three largest upstream memory chip makers are headed for a more than threefold jump in combined DRAM and NAND revenue in 2026, with supply constraints likely to keep pricing firm until new capacity arrives in 2027.

Taiwan’s automation industry is moving beyond the traditional race over robot-arm payload, servo precision, and sensor resolution. At the 2026 Automation Taipei and Taiwan Automation Intelligence and Robot Show, held August 19-22 at the Taipei Nangang Exhibition Center, the industry’s major players all put the spotlight on AI software-hardware integration platforms and open robot architectures as the technologies will determine the next phase of competition.

At the “AI on Chips: Semiconductor Industry Trends Forum” hosted by DIGITIMES in Taipei on August 20, semiconductor, investment, and financial executives gathered to discuss the industry’s next frontier. During the event, DIGITIMES deputy director Jason Tsai pointed out that as electricity supply struggles to keep pace with soaring compute demands, energy efficiency per unit of compute power will dictate the future fate of AI data centers.

With the official launch of Honor’s new Robot Phone, foreign media outlets have renewed their attention on how Chinese smartphone makers are redefining product design. Many have lauded Honor for its ability to pack a mechanically stabilized gimbal into a phone, and moreover move the device from concept showcase to a mass-produced product that consumers can actually buy. In addition, the device serves as a reference for future products in integrating imaging functionality and AI interactivity.