DIGITIMES’s Colley Hwang warns Taiwan AI data center capacity lags South Korea

The inference economy has arrived, and Taiwan’s tech industry must transition from the “knowledge economy” to the “inference economy,” DIGITIMES chairman Colley Hwang said on August 20 at a forum exploring future trends in the semiconductor industry. He also warned that Taiwan’s AI data center capacity is about one-sixth of South Korea’s.

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Longcheer and Luxshare move into robot ODM

China consumer electronics ODMs are extending their R&D, supply chain integration and mass production capabilities into the embodied AI robot market. Longcheer announced on August 19 that it had signed an agreement with the Nanchang High-tech Zone in Jiangxi, officially establishing an embodied AI robot R&D and manufacturing base. The company said it will build end-to-end capabilities from product definition and R&D design to engineering delivery, offering ODM solutions for embodied AI products.

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How credit allocation is becoming part of the AI supply chain

As artificial intelligence (AI) evolves, shifting bottlenecks reflect the maturity of the AI boom. Initial constraints emerged at the semiconductor level with GPUs, high bandwidth memory (HBM), and advanced packaging. Next came system-level challenges around networking, power, and thermal management. More recently, infrastructure limits, including transformers, grid connections, and overall power capacity, took center stage.

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Column: Is 800V really ‘high voltage’? —AI data centers revive an old power debate

High-voltage direct current (HVDC) is currently one of the hottest areas of technology and product development for AI data centers. It is not only the first layer of what Nvidia CEO Jensen Huang has described as the industry’s “five-layer cake,” but also a concrete manifestation of the idea that computing power ultimately depends on electrical power.

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Kenmec surges on AI, advanced packaging to record orders, revenue

Fueled by robust global demand for artificial intelligence and the rapid expansion of semiconductor advanced packaging capacity, Kenmec Mechanical Engineering, a subsidiary of Kenmec Group, has seen its order backlog surge to nearly NT$6.661 billion (approx. US$209.1 million). Driven by this momentum, both the subsidiary and the group overall are on track to hit historic highs in revenue and order intake in 2026.

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LG Display’s new FLiPP is a dream next-generation OLED patterning technology

LG Display has taken a decisive step toward reshaping OLED manufacturing, announcing the successful development of a long‑anticipated “dream technology” that eliminates the need for the conventional fine metal mask (FMM) process. The breakthrough method, branded FLiPP (FMM‑Less innovative Pixel Patterning), will be unveiled publicly for the first time at IMID 2026 in Busan, where the company will…

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