Industry sources reveal that US and European automakers, alongside the National Highway Traffic Safety Administration (NHTSA) and other regulators, have yet to agree on redefining Level 3 (L3) autonomous driving standards. In response, automakers are developing modular frameworks for 2029–2031 models, designed for easy adaptation to evolving regulations through a “Lego-like” approach.

TSMC chairman C.C. Wei highlighted Taiwan’s strong potential in developing drones and multifunctional robots at the recent 12th National Science and Technology Conference. While acknowledging Taiwan’s capacity to produce multifunctional robots, Wei emphasized that beyond AI functionality, successful development would require the integration of semiconductors, software, and precision machinery.

Security chip demand has remained subdued in 2024, falling short of pandemic-era peaks, with customers showing reluctance in inventory replenishment. Industry sources indicate that Taiwanese IC design firms face mounting pressure from Chinese competitors, who are now making inroads not only in core optical sensing technologies but also in peripheral chips.

Xiaomi founder, chairman, and CEO Jun Lei announced on December 25, 2024, that the company’s automotive division has partnered with Nio, XPeng, and Li Auto to integrate their charging networks. The collaboration will add over 10,000 charging stations to Xiaomi’s charging map.