As global display technologies pivot toward thinner, lighter, and more flexible form factors — especially for automotive and smart device applications — Taiwanese glass processor Gtoc Optoelectronics is making a bold move into next-generation materials. The company announced a strategic expansion into the ultra-thin rollable glass cover market, positioning itself as a key supplier for high-end automotive displays and precision glass applications.

Nvidia has unveiled a bold move to revolutionize data center infrastructure with the introduction of an 800-volt high-voltage direct current (HVDC) power distribution system, designed for next-generation AI workloads. Announced recently, the initiative involves strategic partnerships with three major power semiconductor suppliers — Infineon Technologies, Texas Instruments (TI), and Navitas Semiconductor — to co-develop this advanced power solution.

On May 28, 2025, flexible printed circuit board (PCB) maker Flexium Interconnect held its annual shareholders meeting at its Kaohsiung facility, with chairman Ming-Chih Cheng presiding over the event. Marking a new chapter for the company, newly appointed president David Cheng—a United States-based executive—made his formal debut, outlining Flexium’s strategic roadmap for the years ahead.

Charging operators in China, Europe, and the US account for 90% of the world??s public charger deployments. MW fast charging, V2G, and NACS have become key areas of industry focus.