16
Apr
Taiwan’s Kbro Broadband on April 15 unveiled its next-generation 10G broadband service, backed by a planned NT$10 billion (approx. US$316.45 million) investment to upgrade network infrastructure nationwide, marking a decisive step into the 10G era and a strategic push to reposition cable networks at the core of Taiwan’s digital resilience.
16
Apr
TSMC 1Q26 earnings: AI demand sends profit up 58%, gross margin to all-time high
Taiwan Semiconductor Manufacturing Company (TSMC) reported a first-quarter 2026 revenue of US$35.90 billion, a 40.6% jump from a year earlier, as insatiable demand for artificial intelligence (AI) processors pushed the world’s largest contract chipmaker to its highest-ever gross margin.
16
Apr
Rising component costs could shrink smartphone shipments by over 10% in 2026
Rising upstream component costs and higher new-phone prices are expected to slow global smartphone shipments in 2026, fueling stronger demand for used devices internationally and prompting companies to bolster secondhand operations; at the same time, uncertainty from the US‑Iran conflict threatens shipping routes and could disrupt supply flows through Dubai.
16
Apr
China’s homegrown GPU startups gain ground in global AI chip race
China’s domestic GPU industry is entering a new phase of rapid commercialization, as leading startups post strong revenue growth while intensifying investment in research, patents, and ecosystem development.
16
Apr
Tesla AI5 tape-out signals dual sourcing with Samsung, TSMC
Tesla has finalized the design of its next-generation AI5 chip, marking a milestone in its in-house semiconductor development. CEO Elon Musk confirmed the tape-out in a post on X, saying the design has been sent to foundry partners for fabrication. Musk also said Tesla is developing follow-on processors, including AI6 and Dojo3.
16
Apr
Cadence, Nvidia deepen AI partnership to reshape chip design and robotics
Cadence Design Systems and Nvidia have expanded their partnership to accelerate the use of artificial intelligence (AI) across semiconductor design, robotics, and large-scale AI infrastructure, the companies said at CadenceLIVE Silicon Valley 2026. The collaboration aims to combine Cadence’s electronic design automation (EDA) software with Nvidia’s accelerated computing and AI platforms to improve engineering productivity and reduce development cycles.
16
Apr
Sony INZONE M10S II goes official with a 720Hz OLED display
16
Apr
JSR restarts Taiwan production as TSMC dominates advanced nodes
Japanese photoresist leader JSR officially announced on April 15 the establishment of an advanced planarization process solutions research center in Hukou, Hsinchu, Taiwan.
16
Apr
Rockchip reports record results, scales AIoT chips across industries
China-based chip designer Fuzhou Rockchip Electronics posted record full-year 2025 results, with AIoT processors driving growth across automotive, robotics, and industrial markets.
16
Apr
SkyeChip IPO signals Malaysia’s push into high-value chip design
Malaysia-based semiconductor design firm SkyeChip has appointed Maybank Investment Bank and CIMB Investment Bank as underwriters for its planned Main Market listing, according to a report by The Edge Malaysia.