As the rise of artificial intelligence (AI) pushes semiconductor performance toward new limits, the industry is confronting a fundamental constraint: the slowing of Moore’s Law. Increasingly, engineers are turning their attention not just to chip design, but to system integration and advanced packaging, areas now seen as critical to sustaining performance gains.

The rise of new hardware designs for humanoid robots has created fresh opportunities across the supply chain, with linear actuators — which act as the muscles of robots that mimic human anatomy — now becoming key components in this evolution. Amid the ongoing reshuffling in the transmission component supply chain, the consensus among industry players is that Taiwanese and Japanese manufacturers are unlikely to yield their longtime dominant position in the field.

TSMC laid out its capacity expansion plans and advanced node progress at its first quarter 2026 earnings call. Chairman C.C. Wei reaffirmed Taiwan as the primary base for leading-edge production, citing close coordination with its research and development teams.