With chip limits near, focus shifts to packaging and integration

As the rise of artificial intelligence (AI) pushes semiconductor performance toward new limits, the industry is confronting a fundamental constraint: the slowing of Moore’s Law. Increasingly, engineers are turning their attention not just to chip design, but to system integration and advanced packaging, areas now seen as critical to sustaining performance gains.

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Taiwan and Japan solidify lead in transmission component market for humanoid robots

The rise of new hardware designs for humanoid robots has created fresh opportunities across the supply chain, with linear actuators — which act as the muscles of robots that mimic human anatomy — now becoming key components in this evolution. Amid the ongoing reshuffling in the transmission component supply chain, the consensus among industry players is that Taiwanese and Japanese manufacturers are unlikely to yield their longtime dominant position in the field.

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TSMC hints at next-gen LPU bid, stokes speculation that Samsung’s Groq order may not last

TSMC Chairman C.C. Wei disclosed at the company’s first-quarter 2026 earnings call that the foundry is collaborating with a customer on next-generation LPU development —a remark that stopped short of naming Nvidia— but that supply chain observers widely read as signaling TSMC’s intent to compete for the inference chip business currently manufactured by Samsung.

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Yageo posts 40% YoY profit rise in 1Q26, driven by AI demand, price hikes

Passive component manufacturer Yageo held its first-quarter 2026 online earnings call on April 15, reporting strong financial results. Company CEO David Wang said that robust demand from applications related to artificial intelligence (AI) boosted sales of both standard and specialty products. Combined with the gradual impact of price increases, this drove significant growth in revenue and profits for the quarter, exceeding previous projections.

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