AMD said on May 21 that it plans to invest more than US$10 billion across Taiwan’s semiconductor ecosystem to deepen strategic partnerships and expand advanced packaging capacity for next-generation artificial intelligence (AI) infrastructure. The initiative aims to strengthen manufacturing capabilities, accelerate the deployment of AI systems, and support the growing demand for high-performance computing hardware.

Nvidia has detailed a significant structural shift in its data center revenue reporting, introducing a new market segmentation that separates traditional hyperscale cloud providers from a rapidly expanding sector named ACIE, which stands for artificial intelligence clouds, industrial, and enterprise. While hyperscale platforms currently lead initial deployment, management projects that the ACIE segment will eventually outgrow them, owing to the massive scale of the global corporate economy.

Taiwan’s export orders fell 4.0% in April compared to March levels, with orders from the US, China, Europe, Japan, and the ASEAN region all declining. According to data released on May 20 by the Ministry of Economic Affairs (MOEA) for April 2026, six of the seven major export categories saw month-on-month declines, including electronics and ICT products. However, the Ministry expects overall May orders to rebound from April, based on feedback from export-oriented manufacturers.

AI is shifting the semiconductor supply chain’s next bottleneck from wafer fabrication and HBM memory to ABF substrates — a lower-profile but critical packaging material used in high-end CPUs, GPUs, ASICs, and networking chips.