Texas Instruments sues former exec over trade secret theft at GlobalFoundries

Bloomberg reports that Texas Instruments (TI) has sued former vice president Kannan Soundarapandian, alleging he joined GlobalFoundries without fully disclosing his new employer and may bring proprietary power semiconductor knowledge into competitive use. TI is seeking to block his role, arguing it could expose confidential process “recipes, roadmaps, and know-how,” with broader implications for competition in power device manufacturing and advanced process development.

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Yulon to fully back Foxtron production as N7, Bria and Carvia enter mass production

Yulon Motor said at an investor conference on May 20 that it will fully support Foxtron Vehicle Technologies’ production capacity requirements, with the N7, Bria, and the latest Carvia models now being mass-produced at Yulon’s Sanyi plant. The company disclosed first-quarter 2026 operating results and outlined a strategy covering vehicle manufacturing, energy services, asset monetization, and overseas expansion.

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LG Innotek wins long-term substrate deals as Intel and cloud giants secure supply

LG Innotek has secured substrate supply terms with major technology customers that increasingly resemble long-term agreements used in the memory-chip sector, boosting the South Korean supplier’s revenue visibility and reducing profit volatility, according to reports.Hankyung and Yonhap, citing a KB Securities report, said the proposed contracts include large upfront payments, binding multi-year supply commitments with penalty clauses, and equipment investment support from customers.

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Apple unifies hardware Silos to accelerate post-Cook device development

Apple’s new Chief Hardware Officer, Johny Srouji, has launched a reorganization of the company’s device development division. The move shifts executive responsibilities over core product design to accelerate future hardware cycles. According to Bloomberg, the changes integrate the previously independent domains of hardware engineering and hardware technologies under a single leadership structure. The realignment is part of a broader succession plan, following Apple’s announcement that John Ternus — longtime senior vice president of hardware engineering — will become Chief Executive Officer on September 1, 2026.

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