Taiwan’s electronics industry is stepping up its global ambitions as AI, data center infrastructure, and advanced manufacturing reshape supply chains. Speaking at the Chinese National Association of Industry and Commerce (CNAIC) on June 18, 2026, Foxconn chairman and Taiwan Electrical and Electronic Manufacturers’ Association (TEEMA) chairman Young Liu outlined a strategy that combines overseas industrial parks, AI-driven transformation and next-generation factory automation.
Panjit International announced at its shareholders’ meeting on June 18 that it will pursue a “dual-engine” growth strategy focused on automotive and artificial intelligence as demand in both sectors accelerates, backed by a capital investment target of more than NT$10 billion over the next five years.
Imec and Sony Semiconductor Solutions Corporation (Sony) have jointly presented a new integration method for connecting the front and back sides of semiconductor wafers, a step the two organizations say could support future 3D chip-stacking designs for logic and memory devices.
In an exclusive interview with The Wall Street Journal, Apple CEO Tim Cook made an unusually blunt admission. The company is preparing to raise product prices because memory and storage costs have surged to a point Apple can no longer absorb. He said Apple has spent the past stretch trying to shield customers from these cost increases, but the situation has become “unsustainable.”
Japanese Prime Minister Sanae Takaichi is scheduled to visit Assam in northeastern India in early July 2026. According to Nikkei, more than 50 Japanese companies and business groups, including Suzuki, Itochu and Toyota Tsusho, are expected to accompany the delegation, with market attention focused on cooperation in semiconductors and infrastructure.
No account yet?
Create an Account
