IBM and Arm collaborate on dual‑architecture hardware to broaden enterprise AI deployment

IBM and Arm announced a collaboration to build dual‑architecture hardware aimed at running AI and data‑intensive workloads with more flexibility, reliability, and security, potentially affecting enterprise infrastructure worldwide by expanding software choice, easing workload portability, and influencing how organizations deploy mission‑critical applications across cloud and on‑premises environments in the near term.

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Copper price surge drives quarterly lead frame price hikes

Lead frame packaging suppliers are hiking prices to pass along rising costs sweeping through the semiconductor supply chain. Gold, silver, and copper prices continue to climb sharply, significantly raising raw material costs. At the same time, the inventory reduction cycle within the mature process semiconductor market is nearing completion, prompting customers to ramp up orders.

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Precious metal surge drives price hikes for frequency components at TXC and Tai-Saw

Rising global economic uncertainty has fueled safe-haven demand alongside strong industrial consumption, pushing precious metal prices higher. In response, Taiwan’s leading quartz component maker TXC announced a 5–10% price increase effective April 1, 2026. Tai-Saw Technology followed suit by raising prices on filters and other frequency parts, while other Taiwanese suppliers have begun negotiating with customers to reflect rising raw material costs, such as gold.

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South Korea exports hit record US$86bn, chip demand drives breakout above US$80bn

South Korea’s exports climbed to a record US$86.1 billion in March 2026, marking the first time monthly shipments have exceeded the US$80 billion threshold, even as the Middle East conflict disrupted logistics and energy flows. According to the Ministry of Trade, Industry and Energy (MOTIE), the figure was up 48.3% year on year, extending a 10-month run of record monthly exports and lifting the country’s trade surplus to US$25.7 billion — its 14th straight month in the black.

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Asahi Kasei enters AI chip fiberglass market to challenge Nittobo’s dominance

Japan’s Asahi Kasei has announced its official entry into the AI chip supply chain with fiberglass cloth as an insulating substrate material, targeting the current global leader Nittobo, which holds a 90% market share. Meanwhile, Nippon Electric Glass (NEG) also plans to invest in AI-specific fiberglass cloth, signaling accelerated competition among Japanese materials makers for semiconductor opportunities.

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Samsung ramps Texas fab as engineers gather for 2nm push

Samsung Electronics has reportedly moved into the equipment installation and testing phase at its foundry in Taylor, Texas, transitioning from construction to operational setup for 2nm production. More than 3,000 engineers from Samsung and global equipment suppliers have begun gathering at the site, according to ET News, signaling the start of large-scale ramp-up activities.

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