SiPh and advanced packaging shine at Touch Taiwan

The annual Touch Taiwan exhibition will take place April 8-10, 2026, featuring over 300 companies from 12 countries across 820 booths. Jim Hung, chairman of the TDUA, highlighted that with the panel industry undergoing a full transformation, half of the exhibitors this year are non-display manufacturers. The event focuses heavily on new business opportunities in silicon photonics (SiPh) and advanced packaging amid the arrival of the “light over copper” era.

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AMEC acquires Sizone to expand CMP capabilities, outlines 2026 strategy

Chinese semiconductor equipment maker Advanced Micro-Fabrication Equipment (AMEC) announced on March 30, 2026, plans to acquire a stake in chemical mechanical planarization (CMP) equipment firm Sizone through a combination of share issuance and cash. This move could mark AMEC’s entry into the wet process segment, an area where it previously had limited presence.

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