01
Apr
February 2026 notebook industry observation: Capacity sharply reduced during the Lunar New Year holidays, and component shortage persists; shipments of the top five notebook brands decrease 5% month-on-month.
01
Apr
Samsung auctions 123 chip tools during Xi’an NAND upgrade to V8
Samsung Electronics is reportedly overhauling its production lines, offering 123 idle semiconductor tools for sale across South Korea and Xi’an as it shifts to more advanced process technologies.
01
Apr
SiPh and advanced packaging shine at Touch Taiwan
The annual Touch Taiwan exhibition will take place April 8-10, 2026, featuring over 300 companies from 12 countries across 820 booths. Jim Hung, chairman of the TDUA, highlighted that with the panel industry undergoing a full transformation, half of the exhibitors this year are non-display manufacturers. The event focuses heavily on new business opportunities in silicon photonics (SiPh) and advanced packaging amid the arrival of the “light over copper” era.
01
Apr
Nexchip applies for HK listing amid mature-node expansion
Chinese semiconductor foundry Nexchip has applied to list on the Hong Kong Stock Exchange’s Main Board, Guandian.cn reported on March 31, as the company moves to consolidate its position in the mature-node foundry market.
01
Apr
Apple at 50: From PC to mobile, AI shift now in focus
Apple marks its 50th anniversary on April 1, after helping shape multiple waves of the technology industry, from personal computing to the internet and mobile eras. As artificial intelligence (AI) emerges as the next phase, the company is coming under closer scrutiny in the transition.
01
Apr
OpenAI raises record US$122 billion, paving way for superapp pivot
OpenAI has closed a record-breaking US$122 billion funding round, valuing the company at US$852 billion, according to CNBC. The raise — the largest in Silicon Valley history — sets the stage for a highly anticipated IPO expected by the end of the year, The Wall Street Journal (WSJ) reports.
01
Apr
Fujitsu plans 1.4nm AI chip Japan-based production with Rapidus
Fujitsu plans to develop a 1.4nm artificial intelligence (AI) chip and outsource its production to Rapidus in Japan, according to Nikkei. The chip is designed for use in servers and related systems, with a focus on low power consumption and domestic manufacturing.
01
Apr
Sharp names Kawamura as CEO, shifts to growth after restructuring
Sharp has named Tetsuji Kawamura as its president and chief executive officer, effective April 1, marking a shift from restructuring to growth as the company looks to expand its global brand alongside parent Foxconn Technology Group.
01
Apr
Taiwan panel leaders pivot: AUO targets CPO, Innolux advances FOPLP
Taiwan’s panel industry is undergoing a collective transformation, with its two major players adopting distinct technology paths.
01
Apr
AMEC acquires Sizone to expand CMP capabilities, outlines 2026 strategy
Chinese semiconductor equipment maker Advanced Micro-Fabrication Equipment (AMEC) announced on March 30, 2026, plans to acquire a stake in chemical mechanical planarization (CMP) equipment firm Sizone through a combination of share issuance and cash. This move could mark AMEC’s entry into the wet process segment, an area where it previously had limited presence.