TSMC is advancing its silicon photonics (SiPh) advanced packaging platform, Compact Universal Photonic Engine (COUPE), shifting from development to commercial mass production. TSMC vice president and co-chair of the SEMI Silicon Photonics Industry Alliance (SiPhIA), K.C. Hsu, said that over the past 3-6 months, the industry has gradually reached a consensus on the technology roadmap and direction for the next 3-5 years. SiPh has also been designated by the government as a key policy focus in this new era.

India is stepping up its semiconductor ambitions as a new domestic plant begins production, underscoring efforts to build a resilient supply chain and position the country as a global chip manufacturing hub.

Infineon held its “We Power AI” event in Taipei this week, marking the second consecutive year the company has hosted a large-scale forum in Taiwan focused on power-related technologies for AI data centers. Adam White, President of Infineon’s Power & Sensor Systems division, said that Taiwan is the absolute core of the AI data center ecosystem, and the company will continue to collaborate closely with Taiwan’s supply chain partners. Looking ahead, AI servers will gradually upgrade from the current 500 kW per rack specification to the megawatt level. Accordingly, the power semiconductor content in AI data centers will also reach US$150 per kW.