Mirle strategically enters FOPLP, glass substrates, sparking rapid surge in orders

Mirle has achieved significant progress in its semiconductor equipment systems operations recently. As the semiconductor sector has experienced a notable surge in growth momentum, the company has seen a sharp increase in urgent orders, driving strong shipping performance. Current order volumes have risen by 30% to 50% compared to the same period in 2023, underscoring Mirle’s expanding market presence.

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Isuzu accelerates self-driving initiatives, aims for level 4 autonomy by 1Q28

Japan-based automotive manufacturer Isuzu Motors (Isuzu) has set an ambitious goal to industrialize Level 4 self-driving trucks and buses by the end of March 2028 at the latest, with plans to launch services in Japan. This initiative is a key component of Isuzu’s midterm business strategy. To achieve this objective, Isuzu has been actively funding global AI and autonomous startups since 2023. As of the end of August 2024, the company has announced three partnered projects.

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PlayNitride sees growth in 2H24 with rising capacity and utilization rates

As Micro LED applications gain traction, PlayNitride is set for robust growth in the latter half of 2024. August marked a milestone with a record revenue of NT$184 million (US$5.89 million). The company has steadily increased its chip-on-carrier (CoC) production capacity, with utilization rates now surpassing 70% to 80%. Further contributions from turnkey engineering services and equipment sales are expected to propel the company toward breakeven by year-end.

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Material analysis expert MSScorps poised for profit growth in AI, silicon photonics, and CPO markets

With the recent surge in AI, silicon photonics, and co-packaged optics (CPO), combined with TSMC’s advancements in cutting-edge processes, Taiwan’s materials analysis leader MSScorps is set to capitalize on these growing markets. Chairman Chi-lun Liu projects the company will return to its 2023 profit levels by 2025 and expects an even stronger performance in 2026.

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Samsung faces inevitable large-scale semiconductor reorganization as DRAM lead diminishes

Samsung Electronics (Samsung) is not only lagging in the HBM area, but its large lead in universal DRAM also shows signs of erosion, intensifying its internal sense of crisis. There are reports suggesting that Samsung’s business may go through a larger-scale reorganization of personnel and teams at the end of 2024. A business reorganization under new management appears inevitable.

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Shin-Etsu Chemical unveils 12-inch QST substrate, advancing GaN power device production

Shin-Etsu Chemical has announced the successful development of a 12-inch quasi-sapphire template (QST) epitaxial substrate, further expanding its range of solutions for gallium nitride (GaN)-based power devices. This new substrate responds to the semiconductor industry’s increasing demand for larger wafer sizes, aiming to enhance production efficiency and performance across various applications, including electric vehicles, renewable energy, and industrial power systems.

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TSMC had Korean giants’ curiosity, and now their attention: SEMICON Taiwan 2024

The surging momentum of generative AI has placed Taiwan’s semiconductor supply chain at the center of the AI stage. As the industry leader, TSMC showcased its influence at SEMICON Taiwan, attracting rare appearances of South Korea’s memory chip giants, Samsung Electronics and SK Hynix, both seeking closer collaboration with the foundry giant on their next-generation high-bandwidth memory (HBM) production.

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