Meta Green Cooling (MGC) is making a comprehensive push into the AI liquid cooling sector, leveraging its unique full-spectrum capabilities. MGC chairman James Chen noted that, unlike competitors, MGC integrates mechanical design, electromechanical systems, thermal management, monitoring, data center design, and maintenance services under one roof. The company posted a remarkable 215% revenue growth in 2025 and expects similar expansion in 2026 as it capitalizes on rising liquid cooling demand.

Powerchip Semiconductor Manufacturing Corporation (PSMC) has provided new details on its planned sale of the Tongluo P5 fabrication plant to Micron Technology, confirming that the transaction is paired with a broader cooperation framework that includes prepaid reservations for high-bandwidth memory (HBM) back-end wafer manufacturing capacity.

AMD introduced its Helios system platform at CES 2026, marking a significant move in cloud AI computing competition from traditional single-chip performance to full rack-scale solutions. This development follows Nvidia’s GB200 NVL series release and Google’s TPU-based rack product plans disclosed by Broadcom, underscoring an industry trend toward delivering computing power through integrated system platforms rather than isolated chips.

Render Network forecasts that 2026 will see brands adopting fully autonomous AI systems that reflect their identity across customer interactions, while consumer GPUs will enable creators and studios to run advanced AI models locally, expanding access to powerful AI workflows beyond large enterprises.