Bright LED defies market trends, sustains momentum into 2025

As market demand rebounded in 2024, Bright LED Electronics Corp. achieved stable operations starting in the second quarter. The company posted an after-tax net profit of NT$89 million (approx. US$2.78 million) for the first half of the year, representing a 40% year-over-year growth. Despite ongoing uncertainties in order visibility, Bright LED expects its performance in the fourth quarter and throughout 2025 to remain consistent with that of the first half of 2024.

Continue reading

Quanta purchases additional fuel cell systems to accommodate AI burn-in tests

Quanta Computer’s (Quanta) US subsidiary, QMN, has announced the purchase of three fuel cell microgrid systems for US$79.75 million. The company stated that these additional systems are intended for upgrading equipment used in testing and verifying high-end servers, highlighting the significant power demands and ESG considerations associated with AI servers.

Continue reading

China’s largest OSAT provider JCET finalizes acquisition of WD’s subsidiary in Shanghai

On September 30, 2024, JCET, a prominent leader in China’s semiconductor packaging and testing industry, announced that its wholly-owned subsidiary, Changjiang Management Co., had completed the acquisition of an 80% equity stake in SanDisk Semiconductor (Shanghai) Co., Ltd., a packaging and testing subsidiary of Western Digital (WD).

Continue reading

CBT and CARPOST join forces to revolutionize automotive aftermarket with carbon fiber tech

Taiwan’s Carbon-Based Technology (CBT) on October 2 announced a strategic partnership with automotive e-commerce company CARPOST Information System to introduce advanced carbon fiber composite technology to the aftermarket for used luxury and imported vehicles. The collaboration will focus on providing interior design enhancements and exterior upgrades.

Continue reading

NSTC aims to finalize plans for Czech IC design training base by December

Plans to provide local chip design and basic training in Prague under the Taiwan Chip-based Industrial Innovation Program (Taiwan CbI) in October have reportedly been affected due to the Czech Republic’s recent change in government officials. Cheng-Wen Wu, Minister of the National Science and Technology Council (NSTC), stated that both parties are working to reach a solution and hope to finalize plans by the end of December.

Continue reading