Samsung weighs Besi’s Korean rivals for 50-bonder hybrid bonding line as pricing talks drag on
Samsung Electronics is preparing a die-to-wafer hybrid bonding production line with about 50 bonders at its Pyeongtaek campus for next-generation high-bandwidth memory and logic chips, according to The Elec.
Mitsubishi Electric and Sony Semiconductor Solutions form AI factory automation venture
Intel 18A adopts High-NA EUV in dual-certification push
Wistron launches first US-made Nvidia GB300 compute baseboard
Wistron opened its D1 AI smart factory in Fort Worth, Texas, on July 21 local time, and began mass production of the first Nvidia GB300 compute baseboard made in the US. The nearly US$700 million plant, which spans about 324,000 square feet, was unveiled by Wistron chairman Simon Lin and Nvidia founder and CEO Jensen Huang.
Server CPUs are AI boom’s next scarce commodity: Intel, AMD reportedly lock in Chinese buyers
Tesla names TSMC, Samsung, Micron as key partners for Optimus robot scale-up
Tesla is building an entirely new supply chain from scratch to support its Optimus humanoid robot program, with CEO Elon Musk naming TSMC, Samsung, and Micron as critical partners during the company’s second quarter 2026 earnings call on July 22, 2026.
Texas Instruments sees China EV surge and rising analog prices as upcycle broadens
Texas Instruments’ second quarter of 2026 results landed Wednesday with two signals worth parsing beyond the headline numbers: an automotive demand acceleration that TI’s own management didn’t see coming three months ago, and the first analog price increases the company has executed in years. Together, they suggest the current upcycle is broadening in ways the supply chain has not fully absorbed.