Leading ICT manufacturers compete for foothold in automotive electronics with SDVs on the rise

Major contract electronics makers are accelerating strategic realignments in line with the rapid development of automotive electronics and architectures for software-defined vehicles (SDV). Foxconn has continued to clarify its automotive layout as it expands from full vehicle assembly into core electronics for SDVs, by integrating semiconductors, smart cockpits, battery management systems (BMS), and silicon carbide (SiC) power components into its contract design and manufacturing services (CDMS).

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Pan Jit snaps up Vietnam plant to ramp auto chip output

Pan Jit International Inc. signed a definitive agreement on December 18, 2025, to acquire a 95% stake in Torex Vietnam Semiconductor, a move aimed at expanding the Taiwanese firm’s manufacturing footprint and scaling its automotive-grade chip production. The transaction follows an initial memorandum of understanding signed in February 2025 and initiates the formal equity transfer process between the companies.

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Auto suppliers pivot to smart cockpits as EV momentum cools

The global automotive supplier landscape is entering a period of heightened competition as slowing electric vehicle adoption forces a strategic pivot toward digital cabin technology and automated driving systems. While macroeconomic headwinds cloud the sales outlook heading into 2026, the push to upgrade vehicle intelligence is creating a rift between entrenched industry leaders and aggressive new entrants.

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System integration upends traditional Tier 1 automotive suppliers

The automotive industry is experiencing a significant structural transformation, putting traditional Tier 1 suppliers under increasing pressure amid a shift toward system integration (SI) capabilities. Major component manufacturers are facing financial difficulties and operational changes, while companies with advanced integration expertise are poised to capture new market opportunities.

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