LGES posts stronger-than-expected 3Q25 operating profit as energy storage growth offsets EV demand drop

LG Energy Solution (LGES) reported preliminary financial results for the third quarter of 2025, posting an operating profit of KRW 601.3 billion (approx. US$423 million), up 34.1% year-over-year and surpassing market expectations. Despite reduced customer demand following the US removal of electric vehicle (EV) tax credits, LGES’s expanding energy storage system (ESS) business successfully offset the impact.

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OCP Summit: Axiado teams up with Jabil to deliver AI-driven security for OCP modular servers

Axiado Corporation, a pioneer in AI-powered, hardware-based platform security and system management, has announced a strategic collaboration with Jabil, a global leader in engineering, supply chain, and manufacturing solutions. Together, they are developing AI-enhanced cybersecurity and Modular Hardware System (MHS) server solutions aligned with the Open Compute Project (OCP). These next-generation products, designed for advanced AI and cloud workloads, are showcased at the OCP Global Summit, taking place from October 13 to 16, 2025, at booths A1 (Axiado) and C12 (Jabil).

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Korea’s TV giants confront crisis as Chinese competitors rise and consumer habits shift

The golden age of TV in South Korea is fading fast. Once the indispensable centerpiece of every home, the TV is now fighting for relevance as younger viewers turn to their smartphones and streaming services for entertainment. Korean electronics giants Samsung and LG are now fighting a two-front war: a cultural shift away from traditional viewing at home and a relentless market assault from surging Chinese competitors.

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OCP Summit: Arm redefines AI infrastructure with open chiplet collab

At the OCP Global Summit 2025, Arm’s Mohamed Awad, Senior Vice President and General Manager of Infrastructure Business, delivered a keynote urging the data center industry to rethink how systems are built in the age of AI. His talk, titled “What AI Wants: New Silicon, New Systems, and a New Era for the Data Center,” highlighted that performance-per-watt optimization, ecosystem collaboration, and custom silicon are key to meeting the explosive growth in AI workloads.

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OCP Summit: Foxconn Interconnect Technology showcases high-speed and cooling innovations

Foxconn Interconnect Technology (FIT) unveiled its latest high-speed interconnect and thermal management solutions aimed at enhancing 224G generation transmission and energy efficiency at the 2025 Open Compute Project (OCP) Global Summit in San Jose, the US. The exhibition highlighted FIT’s efforts to address rising power consumption challenges in high-performance computing (HPC) and data centers.

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