Samsung Electronics is preparing a die-to-wafer hybrid bonding production line with about 50 bonders at its Pyeongtaek campus for next-generation high-bandwidth memory and logic chips, according to The Elec.

Wistron opened its D1 AI smart factory in Fort Worth, Texas, on July 21 local time, and began mass production of the first Nvidia GB300 compute baseboard made in the US. The nearly US$700 million plant, which spans about 324,000 square feet, was unveiled by Wistron chairman Simon Lin and Nvidia founder and CEO Jensen Huang.