Japan-based Orbray plans to go public by 2029, aiming to raise up to JPY 10 billion. The company intends to strengthen production at its Akita factories and targets JPY 40 billion in revenue by 2029, driven by its diamond and sapphire substrates and ventures in the medical field.
At CyberLink’s Q2 earnings call, Chairman and CEO Jau Huang outlined the company’s strategy to integrate generative AI and AI PC technologies into its software suite. Huang acknowledged the immense pressure CyberLink has faced competing against Microsoft in the PC software domain, and identified Adobe as the key rival in the generative AI landscape.
The Biden Administration has announced that the CHIPS and Science Act will subsidize US$400 million to help Amkor, the largest semiconductor packaging and testing company in the US, build a new US$2 billion semiconductor packaging plant in Peoria, Arizona.
Micron Technology has announced that it is shipping ninth-generation (G9) TLC NAND in SSDs, making it the first in the industry to achieve this milestone.
Samsung Electronics announced its financial results for the second quarter of 2024, reporting revenue of KRW74.07 trillion (approximately US$53.3 billion) and an operating profit of KRW10.44 trillion.
Taiwan Fertilizer Company (TFC) is accelerating its industrial transformation by forging new partnerships with major international firms from Japan and South Korea, focusing on ammonia energy collaborations.
Backend house Powertech Technology (PTI), with its fan-out panel-level packaging (FOPLP) technology, is targeting AI SoC market potential, and expects AI-related revenue to account for 6% of the company’s sales in 2024.
Samsung Display (SDC) and LG Display (LGD) are planning to incorporate their tandem OLED technology into OLEDoS (OLED on Silicon) solutions for next-generation micro OLED displays, aiming to widen their lead over Chinese competitors.