Hyundai labor unrest ripples through Kia, GM Korea supply chains
Thought processThought process
21
Jul
21
Jul
Samsung could overtake SK Hynix in the HBM market by 2027
Samsung Electronics could overtake SK Hynix to lead the global high-bandwidth memory market in 2027 as shipments of HBM4 expand, according to forecasts from UBS cited by Money Today and Financial News.
21
Jul
AI-related power management needs drive e-Fuse demand for Fortune Advanced Technology
Power management IC (PMIC) maker Fortune Advanced Technology is set to list on the Emerging Stock Board on July 22, with an eye on growing demand for high-voltage power management in AI data centers driving the need for e-fuses and smart power management solutions. In addition, shipments of higher-margin products are also lifting revenue for the company, as it seeks opportunities in importing substitute protective components.
21
Jul
Alibaba and Huawei muscle into Singapore’s AI market: SEA-LION swaps Llama for Qwen
Singapore is Southeast Asia’s AI frontrunner. It has also become a proving ground for competing Eastern and Western AI business models. As a global technology and financial hub, the city-state is one of the first battlegrounds where leading US and Chinese AI companies are building their regional presence.
21
Jul
AI boom may reshape SK Siltron sale as chairman reportedly rethinks
SK Group chairman Chey Tae-Won is reportedly making a final decision on the sale of semiconductor silicon wafer subsidiary SK Siltron, as surging AI chip demand raises doubts about whether the asset should be sold at all. While SK originally pushed the sale to improve rebalancing and its financial structure, many inside and outside the group now see securing a stable wafer supply chain as the higher strategic priority.
21
Jul
VSMC warns AI-ready MES is becoming essential for wafer fabs, with China accelerating adoption
TSMC’s sustained capital spending highlights the two foundations of its competitive strength: technology leadership and manufacturing excellence. The latter remains a core advantage not only for TSMC but also for the broader semiconductor ecosystem built around its production model.
20
Jul
HBM4 battle shifts to cooling as hybrid bonding slips
Sixth-generation high-bandwidth memory (HBM4) shipments paired with Nvidia Vera Rubin will keep rising in the second half of 2026, setting up a head-to-head fight among the three major memory makers over stable mass production and supply. Industry sources say the next wave of high-capacity HBM will be decided by one core issue: how effectively vendors solve heat dissipation.
20
Jul
China’s AI smartphone race pits ZTE, StepFun, and Honor against limits of agentic computing
China’s smartphone industry is turning agentic AI into its next growth narrative, with ZTE’s Nubia, StepFun and Honor presenting sharply different visions of how phones should plan tasks, coordinate apps and process personal data.
20
Jul
Alibaba open-sources AI chip software, launches Zhenwu cloud supernode service
Alibaba Group’s chip design unit, T-Head, has open-sourced the software stack behind its Zhenwu AI processors while extending the platform from individual accelerators into rack-scale supernodes and public-cloud computing services.
20
Jul
Oracle’s New Mexico data center reportedly hits cost overruns
Oracle’s US$165 billion data center project in New Mexico is running into higher-than-expected costs due to local concerns about its energy requirements. This case is one of several showing how the build-out of AI infrastructure in the US has become a politically charged issue at the local level due to worries over electricity needs and other issues.