As the number of DRAM stacks in high bandwidth memory (HBM) increases, there will be new developments in Through-Silicon Via (TSV) materials, focus rings and debonding technology used in this field. Memory manufacturers Samsung Electronics and SK Hynix are reportedly collaborating with partners to develop these next-generation solutions.

With Taiwan Semiconductor Manufacturing Company (TSMC) proposing its Foundry 2.0 model, some industry experts compare it with Intel’s IDM 2.0. However, the challenges Intel faces today also reflect the inconvenient truth: everyone sees the benefit of market competition by having Intel compete with TSMC in providing foundry services, but are they truly competing?

Disappointing demand growth, uncertainties surrounding the upcoming US presidential election, and government policy changes have slowed the adoption of electric vehicles (EV), according to industry sources.

US-based semiconductor solutions provider Qorvo has partnered with electronic design automation software and engineering services supplier Cadence Design Systems to help Vietnam boost the talent training efforts of the local semiconductor industry.