AMD CEO Lisa Su has announced plans to increase investment in China during a recent visit aimed at strengthening collaboration in the semiconductor and artificial intelligence sectors between China and the US. Su met with Chinese officials and industry leaders to underline AMD’s commitment to the Chinese market.

On December 17, Rapidus announced a new suite of AI-based semiconductor design tools under its Rapidus AI-Assisted Design Solution (Raads), aimed at supporting the company’s Rapid and Unified Manufacturing Service (RUMS) concept. The technology will be rebranded as Rapidus AI-Agentic Design Solution, with multiple tools scheduled for release starting in 2026. Customers will receive the tools alongside a process design kit (PDK) and reference flows.

As AI inference workloads grow and models expand rapidly, Samsung Electronics and SK Hynix are advancing high-bandwidth memory (HBM) technologies while integrating processing-in-memory (PIM) capabilities. This approach allows computations to occur within memory itself, reducing data movement and easing power and performance constraints.

Apple is widely expected to mark the 20th anniversary of the iPhone in 2027 with a redesigned model, and South Korea’s two dominant display makers—LG Display (LGD) and Samsung Display (SDC)—are already positioning themselves for the project. But industry watchers in South Korea say the two companies are doing so with noticeably different levels of commitment.