Taiwan’s drone industry has grown rapidly in recent years, with output surging from about NT$5 billion (US$154.87 million) in 2024 to NT$12.9 billion in 2025, while export value jumped from NT$140 million to NT$2.9 billion. Still, compared with semiconductors and electronics assembly, the drone sector remains small, making it critical for the industry to expand technology cooperation and secure government subsidies.
During its July 16 earnings conference, Taiwan Semiconductor Manufacturing Company (TSMC) offered an upbeat outlook on AI demand. Responding to competition from Intel’s EMIB advanced packaging technology, chairman and CEO C.C. Wei said TSMC’s CoWoS capacity remains “extremely tight” and welcomed the emergence of additional advanced packaging solutions to help customers alleviate backend manufacturing bottlenecks.
An organization under China’s State Administration of Science, Technology and Industry for National Defense (SASTIND) released the membership list of the National Commercial Space Alliance’s Commercial Space Entrepreneurship Consortium on July 1, offering a rare look at 271 officially recognized space-related organizations. Covering everything from launch services and satellite development to ground infrastructure and financial services, the list signals Beijing’s increasingly institutionalized approach to identifying and supporting established commercial space companies.
A Taiwan-Japan AI technology forum held at Taiwan Expo Japan brought together government, industry, academia and research representatives to discuss AI applications, semiconductor supply chains, smart manufacturing and innovation. Terry Tsao, SEMI’s global marketing chief and head of the organization’s operations in Taiwan, told DIGITIMES before the event that IBM has already demonstrated 2nm chip manufacturing capability in the lab, but the biggest challenge for its licensed partner, Japanese chipmaker Rapidus, to achieve mass production in Hokkaido will be yield.
The surge in AI and high-performance computing (HPC) technologies continues to reshape the semiconductor landscape, as demonstrated by the June 2026 financial performances of key supply chain players in Taiwan. Within this thriving ecosystem, IC testing and design services have emerged as pivotal backbones ensuring the physical viability and operational efficiency of next-generation silicon.
Micron has said its Strategic Customer Agreement (SCA) long-term supply deals with 16 key strategic customers include seven automotive customers — among them Qualcomm, Visteon, and Harman, all key suppliers supporting the automotive ecosystem — reinforcing its push into the auto supply chain. The memory maker said the agreements also cover CSPs and AI infrastructure players.
China and the Netherlands agreed that their governments should create a favorable environment for companies to resolve the Nexperia dispute through consultation, China’s Ministry of Commerce said July 16.
OnePlus is exiting the North American and European markets for its future product launches, while sales of new Realme products will be suspended within its home market of China. The changes to both Oppo sub-brands signal the challenges low- to mid-tier brands face amid rising component costs and a tough global smartphone market this year.
Powertech Technology is deepening its panel-level packaging (FOPLP) strategy after its board approved a joint venture with Broadcom in Singapore to build panel-level advanced packaging (PLP) manufacturing capacity, with the planned investment totaling US$400 million.
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