TSMC Chairman and CEO C.C. Wei used the company’s second-quarter 2026 earnings call to push back on two narratives gaining traction among analysts: that rival packaging technologies threaten TSMC’s advanced packaging business, and that the company should be extracting windfall margins from its dominant market position.

As AI chips and HPC chips continue to draw more power, major advanced packaging orders at ASE, Powertech Technology, and Amkor remain strong, lifting demand for heat spreaders. Semi-conductor materials supplier Niching incorporated heat spreader maker Ming Chun Yuan Micro Precise Technology into the group on July 1, 2026, and analysts expect the merger to lift revenue by 30% and gross margin by 10%.

Universal Microwave Technology (UMT), a manufacturer of satellite and millimeter-wave (mmWave) communication components, suspended trading on July 15 and held a material information briefing. The company announced that its board of directors approved the acquisition of more than a 51% stake in high-frequency connector manufacturer Dynahz Technologies for no more than NT$1.7 billion (approx. US$52.8 million).