Rapidus scales back US 2nm R&D early, raising timeline and funding concerns

With support from the Japanese government, Rapidus has been advancing R&D and pilot production testing to mass-produce 2nm chips by 2027. However, due to funding constraints and schedule pressure, Rapidus has begun scaling back its R&D investment at NY Creates in New York earlier than expected — a move that could negatively impact its mid- to long-term development of advanced process technologies at the 2nm node.

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SK Hynix presses ahead on HBM4 despite tightening AI memory supply

SK Hynix is accelerating its next-generation memory strategy, with stable progress on HBM4 production, aggressive capacity expansion in South Korea, and a growing focus on AI-driven demand expected to reshape the global memory market through the end of the decade. Citing Mirae Asset Securities, reports indicate that SK Hynix’s HBM4 development and mass production timeline is on track, with no significant delays or quality issues observed. The company is expected to align production with major GPU customer roadmaps, and most of its 2026 HBM capacity has already been secured by key clients, reducing near-term uncertainty.

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