Samsung Electronics is facing a new shift in labor relations after the Samsung Electronics branch of the Samsung Group Super-Enterprise Union reportedly lost its status as a majority union following a sharp drop in membership after bonus negotiations. The move weakens the union’s representation and could further fragment future labor talks and union power at Samsung Electronics.

Hiwin Technologies and Qualcomm Inc. announced a partnership at Computex 2026 to integrate Qualcomm Dragonwing Q6 series processors into Hiwin’s Load Port products, delivering edge AI capabilities for semiconductor panel-level packaging (PLP) equipment. The collaboration positions Hiwin’s Load Port as the smart edge node in front-end modules, aiming to improve real-time image processing, status sensing, and anomaly detection on the equipment side.

Senior US officials have begun exploring a highly unconventional idea: taking equity stakes in leading artificial intelligence companies and using the proceeds to share the gains of the AI boom with the American public.

AI rack power density has increased 50 times in five years — and the next jump may be the hardest yet.