Samsung DS rebounds to record KRW20 trillion under new leadership

Samsung Electronics Vice Chairman Jun Young-hyun, since his appointment in May 2024, has spearheaded significant changes at the company’s Device Solutions (DS) division, reversing the company’s decline in high-bandwidth memory (HBM) technology. Samsung’s semiconductor business, once trailing behind Korean rival SK Hynix, has regained competitiveness amid rising AI demand, according to reports from JoongAng Daily and The Korea Times.

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Packaging and testing cluster expected to emerge as TSMC Arizona GigaFab expands

During TSMC’s first earnings call of 2026, CEO C.C. Wei said that key metrics at its Arizona fabs are approaching the level of advanced manufacturing in Taiwan. Rising demand from US-based AI customers supports TSMC’s capacity expansion in the US, prompting back-end packaging and testing supply chain partners to consider expanding their US presence.

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