Amkor to close longstanding Japan chip plant as EV demand slows
Amkor Technology, the US-based semiconductor packaging and testing company, said it will close its Hakodate plant in northern Japan by December 2027, citing weak demand stemming from a slowdown in the global electric vehicle (EV) market. The factory, located in the town of Nanae in Hokkaido, specializes in packaging chips used in automobiles.
TSMC sees memory price hikes unlikely to curb demand as Apple and Samsung adapt
Canon eyes 2027 inkjet wafer planarization launch
Canon said on January 13 that it has developed a new wafer planarization technology designed to uniformly smooth surface irregularities during semiconductor manufacturing. The process applies resin materials using inkjet printing and then presses a glass plate onto the surface, using a stamping-like method to achieve planarization.
Yageo secures full voting control of Shibaura Electronics after Tokyo delisting
Taiwan-based passive component maker Yageo said Japan’s Shibaura Electronics was officially delisted from the Tokyo Stock Exchange on January 13. Following the completion of the share consolidation, Yageo now holds 100% of the voting rights in Shibaura Electronics as of January 15.
Apple’s LCD demand gives Radiant room to expand into AR and OLED
TSMC chair confirms long-term AI demand and commitment to US expansion
Packaging and testing cluster expected to emerge as TSMC Arizona GigaFab expands
In Jodi Shelton’s new podcast, Jensen Huang says Nvidia was forged by suffering
In the inaugural episode of a new leadership podcast, Jensen Huang offers a strikingly unvarnished account of how Nvidia became one of the world’s most valuable technology firms.