Wi-Fi 7 applications and tech development
Based on DIGITIMES Research’s projections, Wi-Fi 7 penetration in electronics products is set to reach 6.4% in 2024.
16
May
16
May
Samsung reportedly ditches self-driving EV software to focus on robotic intelligence
Following reports of Apple’s withdrawal from the development of self-driving electric vehicles, Samsung Electronics is reportedly discontinuing its preliminary research on software algorithms for autonomous vehicles. The company will shift its focus to research and development in robotics due to uncertain commercialization prospects for self-driving technology.
16
May
What are the implications for Amazon purchasing minor share in Alchip?
Amazon participated in the private placement for SIP Core provider Alchip, purchasing around a 0.3% share in Alchip for US$16 million. Regarding this move, Bloomberg Opinion columnist Tim Culpan wrote on LinkedIn that in the current era of the AI development boom, having independent chip R&D capabilities is a major advantage in differentiating one’s competitiveness.
16
May
Hardware supply chain’s pivotal value recognized in Nvidia’s strategies
To maintain its leading position in Artificial Intelligence (AI), Nvidia has mastered its CUDA software, constantly emphasized its affiliation with Taiwan and TSMC, and has even secured strong connections with the server supply chain in practice.
16
May
Kymco unveils e-scooter with integrated charging and battery swapping
In a bold move to cater to the evolving energy needs of consumers, Kymco has launched its first electric scooter series featuring the Ionex BMU battery metering module, which integrates both charging and battery swapping capabilities.
16
May
Tencent Cloud collaborates with BRI and Hi Cloud Indonesia to drive banking technology innovation
Tencent Cloud, the cloud business of global technology company Tencent, has recently announced the signing of a Memorandum of Understanding (MoU) with PT. Bank Rakyat Indonesia (Persero) Tbk. (BRI) and Hi Cloud Indonesia, a cloud service provider (CSP). The collaboration aims to drive innovation in BRI’s banking services by leveraging technology, with a specific goal to enhance customer service and transaction experiences.
16
May
India reportedly contemplates IP pool for chip startups
Amidst endeavors to cultivate a semiconductor ecosystem, India is purportedly contemplating creating an IP pool for semiconductor startups, mirroring the approach adopted by Taiwan in nurturing its semiconductor ecosystem.
16
May
Stellantis forms JV with Leapmotor, EU likely to put punitive tariffs on Chinese EVs
European automaker Stellantis has deepened ties with its Chinese partner Leapmotor.
16
May
Semiconductor firms’ ranking as ‘most-desired employers’ rising fast in Japan
Several media reports that young American engineers complained about working at TSMC. How about Japanese engineers? Would they be holding grudges too?
16
May
Foxconn, Siemens team up for smart manufacturing
Siemens and Hon Hai Technology Group (Foxconn) have signed a Memorandum of Understanding (MoU) to accelerate digital transformation and sustainability in smart manufacturing systems.