China-based EV startup Nio’s total revenues reached CNY10.29 billion (US$1.54 billion) in the second quarter of 2022, a 21.8% increase from the previous year. However, the company’s overall gross margin and vehicle margin both declined mainly due to the growing battery costs.

With traditional OSAT providers, IDMs and foundries like Intel, TSMC and ASE heading into advanced packaging technologies to tap the growing high performance computing market, concerns about sustainability have started to drive industry trends. According to Jun He, TSMC’s vice president of quality and reliability, the narrowing linewidth and growing difficulty to extend Moore’s Law makes advanced packaging, system integration and material innovation increasingly important to sustain the momentum of increasing transistor count per unit area. Meanwhile, Min-Te Chen, a director at TSMC who also chairs SEMI Taiwan Materials Committee, observed that the global sustainability development is reaching a new milestone, so the current shared goal of the semiconductor industry is to align the push for advanced process technology with sustainability goals, and that can be done through innovation in materials.

Compal Electronics has developed a railway safety system through integrating 5G real-time data transfers and C-V2X (Cellular-Vehicle to Everything) wireless connectivity, both in compliance with 3GPP (3rd Generation Partnership Project) specifications, with AI-based image recognition technology. It is the first smart decision-making and early warning system for railway safety in Taiwan, according to the company.

China-based smartphone vendor Xiaomi has stepped into developing autonomous electric vehicles (EVs), and will reportedly adopt LiDARs developed by China-based Hesai Technology for its first autonomous EV, according to industry sources.