京东方宣布MLED透明显示技术获突破：透明度超65%、亮度超1000nit
近日，BOE（京东方）在LED透明显示领域取得重要进展，研发团队成功攻克透明像素结构设计、高开口率背板等行业难题，创新研发出超高透过率主动式驱动MLED透明显示产品，透明度高达65%以上，亮度超过1000nit，整体性能居业内领先水平。更高的亮度和透明度，使场景交融效果大大增强，产品展示性、互动性和观众的体验观感超乎想象！
26
Oct
26
Oct
投资23.5亿元！旭格光电液晶显示屏、整机等项目落地衢州柯城
10月19日下午，柯城区生态工业服务中心与海东市旭格光电科技有限公司签订年产6000万片液晶显示屏、6000万片LCD液晶面板切割、6000万片LCD液晶面板光学材料贴附、3000万片OGS全贴合、3000万台整机装配项目投资合作协议。
26
Oct
突发！LG Display暂停坡州大尺寸OLED工厂部分生产线
LG Display将从11月中旬开始停止生产用于电视的OLED面板的坡州工厂，为期一个多月。这是由于在全球经济低迷时期电视需求萎缩导致库存激增。
26
Oct
消息称LCD电视面板价格已停止下跌
10月25日消息，据国外媒体报道，据业内消息人士称，LCD电视面板价格已停止下跌，而面板制造商的大幅减产帮助阻止了价格的下跌。
26
Oct
京东方A等55家“果链”企业承诺100%使用可再生能源为苹果生产
该倡议显示，苹果几乎所有中国供应商都已经正在扩大对风能和太阳能等清洁能源的使用，其中包括京东方A、蓝思科技、领益智造、欣旺达、立讯精密、裕同科技等55家苹果中国主要生产合作伙伴，都已承诺100%使用可再生能源为苹果生产产品。全球范围内，共有200多家苹果供应商已加入这一承诺。
26
Oct
26
Oct
南玻A Q3净利暴涨超3倍 前三季度净利增9.32%
10月24日晚，玻璃龙头南玻A（000012.SZ）发布三季报，今年第三季度公司实现营业收入42.85亿元，同比增长17.97%；实现归属于上市公司股东的净利润6.49亿元，同比增长312.78%，扣非净利润。
26
Oct
Sharp’s new Aquos XLED EP1 series of 4K TVs are launched in Japan
Today Sharp has launched in Japan the Aquos XLED EP1 series of 4K TVs with N-Black panels with HDR10, HLG, and Dolby Vision certification. They employ the brand’s active mini LED drive technology which divides the mini LED backlight into more than 1000 areas to finely control bright and dark areas. Thanks to this technology, these 4K XLED TVs deliver three times higher peak brightness than that…
25
Oct
SiC wafer industry status
Soaring silicon carbide (SiC) demand from electric vehicles (EV) is leading to a tight supply of 6-inch SiC wafers, of which the cost will unlikely go down.
25
Oct
Chiplet mass adoption easier said than done
As the semiconductor industry once again frets over the future of Moore’s Law, the notion of chiplets has gained traction, especially as the technology has come to be prominently featured by Intel as a key driver to its future growth, underpinning the “system foundry” promoted by Intel CEO Pat Gelsinger. At the intel Innovation Forum in late September, leading foundries like TSMC and Samsung even rallied behind Intel, publicly voicing their support for the Universal Chiplet Interconnect Express (UCIe) consortium initiated by Intel to provide an open standard for the interconnects between chiplets. Industry heavyweights including AMD, Arm, Google, TSMC and ASE have all joined the consortium.